Noise-Con 08

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Participating Vendors


Microtech Gefell GmbH
OROS-Noise&VibrationSolutions
Data Physics Corp
Carsonite
3M Acoustic Solutions
Homasote
3M Acoustic Solutions
KineticsNoiseControl
Pyrok,Inc.
OverlyDoorCompany
ACO Pacific, Inc,
Bruel & Kjaer
G.R.A.S. Sound and Vibration.
Navcon Engineering Network
QT Impact Sound Insulation
Casella USA 
PCB Piezotronics and Larson Davis
International Cellulose Corporation
PAC International, Inc.
ViAcoustics
Coustyx: Fast Multipole Acoustics
Foamex International
Eckel Industries Inc, Acoustic Division
HEAD acoustics
SVcommunity.com
Scantek, Inc.
Sound Fighter Systems, LLC.
MaxxonCorporation
Custom Building Products
LMS
Plywall/HooverTreatedWoodProducts,Inc.
ESI Group
National Instruments
Muller-BBM VibroAkustik Systeme, Inc.
IAC America
PCB Piezotronics and Larson Davis
MSC Material Sciences Corporation
Jamison Door Company
Optinav
Carcoustics
Noise Control and Acoustics
Rousch Industries, Inc.
Vibro-Acoustics


Contact Information

Noise-Con 2008
General Chair

Teik Lim
University of Cincinnati

Technical Chair
Jay Kim
University of Cincinnati

Exhibitions Chair
Rich Peppin
Scantek, Inc.

Student Paper Competition
Ralph Muehleisen
Illinois Institute of Technology

Sound Quality Symposium 2008
General & Technical Co-Chairs
Gordon Ebbitt
Carcoustics

Patricia Davies
Ray W. Herrick Labs, Purdue University

Organizing Committee
Wade Bray
HEAD Acoustics

Gabriella Cerrato Jay
Sound Answers

ASME 30th NCAD Meeting
General & Technical Chair
Steve Hambric
ARL, Penn State University

Congress Secretariat
INCE Business Office